Last edited by Dilmaran
Wednesday, July 15, 2020 | History

3 edition of Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP "06) found in the catalog.

Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP "06)

IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (8th 2006 Shanghai, China)

Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP "06)

June 27th-June 30 2006 : Shanghai University, Shanghai, China

by IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (8th 2006 Shanghai, China)

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  • 11 Currently reading

Published by IEEE in Piscataway, NJ .
Written in English

    Subjects:
  • Integrated circuits -- Design and construction -- Congresses.,
  • Electronic packaging -- Congresses.,
  • Microelectromechanical systems -- Congresses.

  • Edition Notes

    Other titles2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP "06), Proceedings, HDP "06
    Statementorganized by IEEE ... [et al.].
    GenreCongresses.
    ContributionsInstitute of Electrical and Electronics Engineers., Components, Packaging & Manufacturing Technology Society.
    Classifications
    LC ClassificationsTK7874 .I3227 2006
    The Physical Object
    Pagination328 p. :
    Number of Pages328
    ID Numbers
    Open LibraryOL16258844M
    ISBN 101424404886, 1424404894
    LC Control Number2006926703


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Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP "06) by IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (8th 2006 Shanghai, China) Download PDF EPUB FB2